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Ceramic Capacitor Electrode Sintering Furnace

A precision sintering solution designed for Ceramic Capacitors (MLCC), electronic ceramics, and Base Metal Electrodes (BME). By precisely controlling high-vacuum purging and hydrogen reducing atmospheres, it ensures zero oxidation of nickel/copper electrodes while optimizing the density and electrical properties of the ceramic dielectric.

Product Overview

This series of sintering furnaces is developed for the extreme purity and reducing atmosphere requirements of electronic ceramic components. Featuring a fully sealed 310S heat-resistant stainless steel muffle, combined with multi-stage vacuum systems and high-precision hydrogen control, it enables dynamic adjustment of oxygen partial pressure at processes up to 950°C. This resolves the oxidation challenges of base metal electrodes at high temperatures, ensuring high reliability and consistency.

Key Advantages

  • Electrode Anti-Oxidation: Deep high vacuum combined with reducing hydrogen protection effectively prevents the oxidation of internal electrodes like Nickel (Ni) and Copper (Cu), maintaining excellent conductivity.
  • Precision Thermal Management: Equipped with Swedish Kanthal heating elements and ±0.1°C control accuracy, ensuring consistent shrinkage and capacitance after mass sintering.
  • Rigorous Safety Control: Features auto-ignition, N2 purging, and real-time pressure monitoring with multi-level logic interlocks for secure H2 processing.
  • Ultra-Clean Environment: Strict leak rate control (≤ 2 Pa/h) and oil-free interior design ensure a contaminant-free environment, meeting the stringent standards of electronic ceramic production.

Technical Specifications

Item Specifications
Muffle Material 310S or Special Heat-resistant Stainless Steel
Pressure Rise Rate ≤ 2 Pa/h (High vacuum standard)
H2 Safety System Auto Ignition + Emergency N2 Purging System
Heating Elements Swedish Kanthal or High-performance Alloys
Vacuum System Mech Pump + Diffusion/Molecular Pump
Rated Temperature 950°C (Stable operation within process range)


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