Product Overview

This series of furnaces is engineered for electronic components requiring extreme airtightness and vacuum cleanliness. It integrates high-vacuum pump sets (Diffusion/Molecular) and multi-level safety-interlocked hydrogen systems. At processes up to 950°C, it not only removes trace gases from parts but also completes precision brazing under a reducing atmosphere, ensuring oxide-free and pore-free joints that meet aerospace and industrial standards.

Key Advantages

• Superior Brazing Quality: Flux-free brazing in a vacuum enhances solder wetting through reducing atmospheres, achieving high-strength, airtight ceramic-to-metal bonding.


• Deep Degassing: A low leak rate (≤ 2 Pa/h) combined with high vacuum effectively removes impurity atoms and residual gases, preventing post-production vacuum degradation.


• Rigorous Safety Control: Features auto-ignition, pressure monitoring, and emergency N2 purging to ensure H2 brazing processes are executed with zero safety risks.


• High Cleanliness: All-stainless steel muffle design eliminates volatile contamination. Swedish Kanthal heating elements ensure superior thermal uniformity for high yields.

Technical Specifications